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Atom, with codenames of and, was first announced on March 2, 2008. For Nettop and Netbook Atom Microprocessors after Diamondville, the memory and graphics controller are moved from the to the CPU. This explains the drastically increased transistor count for post- Diamondville Atom microprocessors. Intel Atom N455. All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation),.
These models do not support or and are limited to 2 of memory. Graphics and memory controller are integrated into the processor, but graphics sometimes disabled in favor of discrete video chip. Transistors: 123 million (single-core), 176 million (dual-core). Die size: 66 mm² (9.56 × 6.89) (single-core), 87 mm² (9.56 × 9.06) (dual core). Package size: 22 mm × 22 mm Model number sSpec number Cores Frequency GPU frequency I/O bus Release date Part number(s) Release price Atom N435. DF503 $47 processors/SoCs (//) ' (45 nm). All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation).
Models Z520, Z520PT, Z530, Z530P, Z540, Z550 and Z560 support and. Models Z500, Z510P, Z510PT, and Z515 support Hyper-Threading only. Model Z515 supports Intel Burst Performance Technology. Transistors: 47 million.
Die size: 26 mm². Package size: 13 mm × 14 mm / 22 mm × 22 mm (processors ending with the P or PT sSpec number). Steppings: C0 Model number sSpec number Cores Frequency Release date Part number(s) Release price. 'SoFIA' redirects here.
For other uses, see. SoFIA ( Smart or Feature Phone with Intel Architecture).
All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation), Intel Burst Performance Technology (BPT), (based on Silvermont's specs). GPU and memory controller are integrated onto the processor die. Package size: 34 × 40 mm. SoFIA 3G SoC with Silvermont CPU.
Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3130). SoFIA 3G–R SoC with Silvermont CPU. Integrated HSPA+ A-GOLD 620: 2G/3G RF, CNV, PMU, Audio (Atom x3-C3230RK).
SoFIA LTE (W) with Airmont CPU. Integrated LTE Cat. 4 (XG726-based), SMARTi™ 4.5, LnP/ CG2000, PMIC (Atom x3-C3440 & C3445) Model number sSpec number Cores Frequency Burst GPU model GPU frequency Connectivity Release date Part number(s) Release price 2 1.0 GHz N/A 512 KB Mali 400 MP2 (dual core) 480 MHz 1×32 LPDDR2 800 2G/3G, GPS, Bluetooth, WiFi 2 W H1 2015. PMB8020.P20 processors/SoCs ' (45 nm).
All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation),. All except Z605 support Intel Burst Performance Technology (BPT). GPU and memory controller are integrated onto the processor die. Transistors: 140 million. Die size: 7.34 mm × 8.89 mm = 65.2526 mm².
Package size: 13.8 mm × 13.8 × 1.0 mm. Steppings: C0 Model number sSpec number Cores Frequency GPU frequency I/O bus Release date Part number(s) Release price. DG500 $41 No official TDP available. For power data see page 129-130.
' (22 nm). All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation), Intel Burst Performance Technology (BPT),. GPU and memory controller are integrated onto the processor die. GPU is based on, with 4 execution units, and supports DirectX 11, OpenGL 4.0, OpenGL ES 3.1 and OpenCL 1.1 (on Windows).
Package size: 17 mm × 17 × 1.0 mm Model number sSpec number Cores Frequency Burst GPU model GPU frequency Release date Part number(s) Release price Atom Z3680. FH628 $40 ' (14 nm). All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation), 2 (VT-x with, FlexMigration, FlexPriority and VPID ),. GPU and memory controller are integrated onto the processor die. GPU is based on 8th generation , with 12 (x5 models) or 16 (x7 models) execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.1 and OpenCL 1.2 (on Windows).
Package size: 17 mm × 17 × 1.0 mm Model number sSpec number Cores Frequency Burst GPU model GPU frequency Release date Part number(s) Release price. FJ827 $37 processors/ ' (45 nm). CPU core supports architecture, Enhanced Intel Technology (EIST),. It has 32K L1 Instruction Cache, 24K L1 Data Cache, 512K L2 Cache. Peripherals include (two video outputs), (2GB max), controller, controller, 4 channels of ×1, and various legacy devices. Package size: 22 mm × 22 mm.
Steppings: B0. Temperature range: for (E620, E640, E660, E680): 0°C to +70°C, for (E620T, E640T, E660T, E680T): -40°C to +85°C. Model number sSpec number Cores Frequency GPU frequency I/O bus Release date Part number(s) Release price. CT5AB $85 ' (45 nm).
' CPU with an Altera Field Programmable Gate Array (FPGA). CPU core supports architecture, Enhanced Intel Technology (EIST),. It has 32K L1 Instruction Cache, 24K L1 Data Cache, 512K L2 Cache.
Peripherals include (two video outputs), (2GB max), HD Audio controller, controller, 4 channels of ×1, and various legacy devices. Package size: 37.5 mm × 37.5 mm. Steppings: B0. TDP without FPGA. Total package TDP depends on functions included in FPGA.
Temperature range: for (E625C, E645C, E665C): 0°C to +70°C, for (E625CT, E645CT, E665CT): -40°C to +85°C. Model number sSpec number Cores Frequency GPU frequency I/O bus Release date Part number(s) Release price. CY4AA $106 ' (22 nm). All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation),. GPU and memory controller are integrated onto the processor die. GPU is based on, with 4 execution units, and supports 2 displays, DirectX 11, OpenGL 4.0, OpenGL ES 3.1 and OpenCL 1.1 (on Windows).
Peripherals include 2.0, HD Audio controller, with 2 ports, and 4 lanes of 2.0, in x4, x2, and x1 configurations. Package size: 25 mm × 27 mm Model number sSpec number Cores Frequency Burst GPU model GPU frequency Release date Part number(s) Release price. FH715. FH717. FH719. FH719 $52 ' (14 nm). All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation),.
GPU and memory controller are integrated onto the processor die. GPU is based on, with 12 execution units, and supports DirectX 11.2, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 1.2 (on Windows). Package size: 25 mm × 27 mm Model number sSpec number Cores Frequency Burst GPU model GPU frequency Release date Part number(s) Release price. FH946 $39 ' (14 nm). All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation), (DDR3). GPU and memory controller are integrated onto the processor die.
GPU is based on, with 12 (x5) or 18 (x7) execution units, and supports 1.4 ( @ 30Hz), 1.2 (4K @ 60Hz), and 1.3 (4K @ 60Hz). Package size: 24 mm × 31 mm Model number sSpec number Cores Frequency Burst GPU model GPU frequency Release date Part number(s) Release price 2 1.3 GHz 1.8 GHz 2 400–550 MHz 4 × DDR3L-1866 4 × LPDDR4-2133.
DH80S1289 $120 ' (22 nm). All models support:, Enhanced Intel Technology (EIST), (according to Datasheet), XD bit (an implementation),. Dual-core peripherals include 4 × 2.0, 2 ×, 2 × Integrated, 2 ×, and 4 lanes of 2.0, in x4, x2, and x1 configurations. Quad-core SoC peripherals include 4 × 2.0, 2 (C2530) or 6 (C2550) ×, 2 × Integrated, 2 ×, and 8 lanes of 2.0, in x8, x4, x2, and x1 configurations. C2730 peripherals include 4 × 2.0, 2 ×, 2 × Integrated, 2 ×, and 8 lanes of 2.0, in x8, x4, x2, and x1 configurations. C2750 peripherals include 4 × 2.0, 6 ×, 4 × Integrated, 2 ×, and 16 lanes of 2.0, in x16, x8, x4, x2, and x1 configurations. Package size: 34 mm × 28 mm Model number sSpec number Cores Frequency GPU frequency I/O bus Release date Part number(s) Release price.
FH906. FH600 $171 ' (22 nm). All models support:, Enhanced Intel Technology (EIST), XD bit (an implementation),. All models except C2x38 support Intel Technology (cryptography accelerator). peripherals include 4 × 2.0, 4-6 × (1 for C2308, 2 for C2316, C2508, C2516), 4 × Integrated (2 for C2316), 2 ×, and 8-16 lanes of 2.0 (4 lanes for C2308), in x16, x8, x4, x2, and x1 configurations. Package size: 34 mm × 28 mm Model number sSpec number Cores Frequency GPU frequency I/O bus Release date Part number(s) Release price. FH702.
FH000 $208 ' (14 nm). All models support:, Enhanced Intel Technology (EIST), (dual-core, C3xx0, C3xx5 only), XD bit (an implementation),. C3336 also supports. peripherals include 8–16 × 3.0, 6–16 × (C3xx8 only), 4 × Integrated, and (C3538 and up), and up to 20 lanes of 3.0, in x8, x4, and x2 configurations. Package size: 34 mm × 28 mm Model number sSpec number Cores Frequency GPU frequency I/O bus Release date Part number(s) Release price.
You will receive a reply within 2 business days. Please submit your comments, questions, or suggestions here. Processor Base Frequency describes the rate at which the processor’s transistors open and close. Search examples You can search our catalog of processors, chipsets, kits, SSDs, server products and more in several ways. Please submit your comments, questions, or suggestions here. Uploader: Date Added: 8 March 2012 File Size: 63.57 Mb Operating Systems: Windows NT/2000/XP/2003/2003/7/8/10 MacOS 10/X Downloads: 45761 Price: Free.Free Regsitration Required Intel Desktop Board DPT Specs – CNET Cores is a hardware term that describes the number of independent central processing units in a arom computing component die or chip. If sold in bulk, price represents individual unit.
I can tell you, for a fact that the capture card is seen by windows, and even what bus its on (through Everest), but that doesn't really matter, what I want to know is if someone knows of something other than the typical lot of software and OS's dedicated to this (Mythbuntu for one is off the list, I am not a fan of Linux nor am I willing to dual-boot, and it does not seem compatible with this card). 4GB (3.5 visible, 500MB ate by the GPU by force, not that it really helps, the 8500 is a piece of crap, not even a paperweight as its heatsink is nearly useless) of RAM nVidia (MSI) 8500 GT 512MB PCI-E 16x 1.0 GPU 160GB SATA300 and 320GB ATA100 western digital drives MSI P6N Diamond (MS-7320) LGA775 nVidia 680i motherboard And of course, that bothersome Harmonics (Conexant) CX2388x TV Card which I cannot get to work. And if they know of a driver to get it working. Its an abomination but it does the trick.
C1 is the first idle state, C2 the atpm, and so on, where more power saving actions are taken for numerically higher C-states. Add to Compare Shop for this product. Allows for delivery and returns. Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
RAID Redundant Array intel atom cpu d410 Independent Disks is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required. Downloads for Intel Atom速 Processor D410 (512K Cache, 1.66 GHz) Idle States C-states are used to save power when the processor is idle.
Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Prices may vary for other package types and shipment quantities. All information provided is subject to change at any time, intel atom cpu d410 notice. System and Maximum TDP is based on worst case scenarios. Thermal Design Power TDP represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. This specific part is no longer being manufactured or purchased and no inventory is available. For benchmarking data see http: Frequency is measured in gigahertz GHzor billion cycles per second.
Intel速 Desktop Board D410PT Listing of RCP does not constitute a formal pricing offer from Intel. Used for end of life products. Prices intel atom cpu d410 for direct Intel customers, typically represent 1,unit purchase quantities, and are subject to change without notice. You can search our catalog of processors, chipsets, kits, SSDs, server products and more in several ways.
Your personal information will be used to respond to this inquiry only. All information provided is subject to change at any time, without notice. Please refer to the Launch Date for market availability. It offers improved manageability by limiting downtime and intel atom cpu d410 productivity by isolating computing activities into separate partitions. Search examples You can search our catalog of processors, chipsets, kits, SSDs, server products and more in several intel atom cpu d410.
Please submit your comments, questions, 4d10 suggestions here. An on-die Digital Thermal Sensor DTS detects the core’s temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order inntel remain within normal operating limits. System and Maximum TDP is based on worst case scenarios. Intel Atom速 Processor D (K Cache, GHz) Product Specifications The intel atom cpu d410 herein is provided “as-is” and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, intel atom cpu d410, or compatibility of the products listed.
Your comments have been sent. You will receive a reply within 2 business days. Core i7 Product Number: Graphics Output defines the interfaces available to communicate with display devices. Prices may vary for other package types and shipment quantities.
Highly threaded applications can get more work done in parallel, completing tasks sooner. Add to Compare Shop for this product.